MAZLAN, Muhammad Dinie; HASSAN, Hasliza. Non-Destructive Test for IC Package With 8D Report. Evolution in Electrical and Electronic Engineering, [S. l.], v. 3, n. 1, p. 044–052, 2022. Disponível em: https://periodical.uthm.edu.my/index.php/eeee/article/view/6676. Acesso em: 15 aug. 2026.